
BOOKS - TECHNICAL SCIENCES - Robust Design of Microelectronics Assemblies Against Mec...

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Author: E.-H. Wong and Y.-W. Mai
Year: 2015
Pages: 477
Format: PDF
File size: 25,44 MB
Language: ENG

Year: 2015
Pages: 477
Format: PDF
File size: 25,44 MB
Language: ENG

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